Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.
Yonggang Huang, John A Rogers, Kyung-In Jang, Yihui Zhang, Young Min Song, Chi Hwan Lee, Daeshik Kang, Hyeong Min Jin, Nuri Oh, Jeonghyun Kim, Anthony Banks, Seungyong Han, Sang Min Won, Bowen Ji, Bong Hoon Kim, Jungyup Lee, Jan-Kai Chang, Yechan Lee, Arin Ryu, Do Hoon Kim, Kun Hyuck Lee, Ji Yoon Jeong, Hokyung Jang, Youn Kyoung Cho, Yongjoon Yu, Zhaoqian Xie, Jong Yoon Lee, Fei Liu, Xueju Wang, Qingze Huo, Seunghwan Min, Di Wu
ACS nano 2019;12(5):4164-4171