A comprehensive review of starch-based technology for encapsulation of flavor: From methods, materials, and release mechanism to applications.

Fengzhong Wang, Dezhi Li, Liya Liu, Lili Wang, Yue Zhang, Jiaxin Li, Yang Li, Yimeng Shan, Mengzi Nie, Li-Tao Tong

Journal: Carbohydrate polymers 2024;348(Pt A):122816

PMID: 39562091

Abstract

Encapsulation of flavor and aroma compounds in appropriate materials and forms has long been an important issue. Encapsulation of flavor in inexpensive, stable, and widely used starch-based materials could preserve or mask characteristic aroma compounds, improve flavor thermal and oxidative stability, control release, and increase bioavailability. However, several technical challenges still hinder the application of starch-based encapsulated flavor complexes in the food industry. This study comprehensively and systematically the encapsulation technology of starch-based materials, the properties and applications of starch-based materials, and the flavor release mechanism of encapsulated compounds, aiming to provide insights into the rational design of starch-encapsulated flavor. While choosing flavor encapsulation materials for industries, starch, cyclodextrins, maltodextrin, octenyl succinic anhydride starches, and porous starch are worthy of consideration. On this basis, future research directions for the nutritional value of starch-encapsulated flavor compounds and their application in the food industry are proposed. To elucidate the release mechanisms and application efficiencies of various starch-based flavor complexes, it is necessary to investigate the conformational interactions as well as applications in various food and gastrointestinal systems.

Copyright © 2024 Elsevier Ltd. All rights reserved.

Address: Institute of Food Science and Technology/Western Research Institute, Chinese Academy of Agricultural Sciences, Beijing 100193, China.; Institute of Food Science and Technology/Western Research Institute, Chinese Academy of Agricultural Sciences, Beijing 100193, China. Electronic address: [email protected].; Institute of Food Science and Technology/Western Research Institute, Chinese Academy of Agricultural Sciences, Beijing 100193, China; Zhongyuan Research Center, Chinese Academy of Agricultural Sciences, Xinxiang 453500, China. Electronic address: [email protected].

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